Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15406732
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Filing Dt:
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01/15/2017
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Publication #:
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Pub Dt:
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09/05/2019
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Inventors:
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Haiguang Chen, Jaydeep Sinha, Sergey Kamensky, Sathish Veeraraghavan, Pradeep Vukkadala
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Title:
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SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZATION AND WAFER CLASSIFICATION USING WAFER DIMENSIONAL GEOMETRY TOOL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| SUITER SWANTZ/KLA JOINT CUSTOMER NUMBER |
| 14301 FNB PARKWAY |
| SUITE 220 |
| OMAHA, NE 68154-5299 |
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