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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10629477
Issue Dt:
04/21/2020
Application #:
16416965
Filing Dt:
05/20/2019
Publication #:
20190273018
Pub Dt:
09/05/2019
Inventors:
An-Jhih Su, Der-Chyang Yeh, Jing-Cheng Lin, Chen-Hua Yu, Chi-Hsi Wu, Ming Shih Yeh et al
Title:
RAISED VIA FOR TERMINAL CONNECTIONS ON DIFFERENT PLANES
Assignment: 1
Reel/Frame:
052875/0606Recorded: 06/09/2020Pages: 11
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE 7TH INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 042883 FRAME: 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
YU, CHEN-HUA
Exec Dt:
05/02/2020
SU, AN-JHIH
Exec Dt:
05/04/2020
WU, CHI-HSI
Exec Dt:
06/06/2020
YEH, DER-CHYANG
Exec Dt:
05/05/2020
YEH, MING SHIH
Exec Dt:
05/05/2020
LIN, JING-CHENG
Exec Dt:
06/04/2020
KUO, HUNG-JUI
Exec Dt:
05/05/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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