Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15917195
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Filing Dt:
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03/09/2018
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Publication #:
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Pub Dt:
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09/12/2019
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Inventors:
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Yue Zhang, Michael H. S. Dayringer, Nyles Nettleton
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Title:
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METHOD AND APPARATUS FOR STACKING WARPED CHIPS TO ASSEMBLE THREE-DIMENSIONAL INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 500 ORACLE PARKWAY |
| MAIL STOP 5OP7 |
| REDWOOD CITY, CALIFORNIA 94065 |
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| A. RICHARD PARK |
| PARK, VAUGHAN, FLEMING & DOWLER LLP |
| 2820 FIFTH STREET |
| DAVIS, CA 95618 |
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