Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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16345166
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Filing Dt:
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04/25/2019
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Publication #:
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Pub Dt:
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09/19/2019
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Inventor:
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Masakazu ISHIKAWA
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Title:
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DIELECTRIC-HEATING BONDING FILM AND BONDING METHOD USING DIELECTRIC-HEATING BONDING FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173-0001 |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET |
| WASHINGTON, DC 20001 |
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