Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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16016802
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Filing Dt:
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06/25/2018
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Publication #:
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Pub Dt:
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09/26/2019
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Inventors:
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Ting-Chang Chang, Chih-Cheng Shih, Ming-Hui Wang, Wen-Chung Chen, Chih-Yang Lin
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Title:
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METHOD FOR BONDING ONE COMPONENT TO ANOTHER COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 70, LIEN-HAI RD., GUSHAN DIST. |
KAOHSIUNG CITY, TAIWAN |
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
8230 BOONE BLVD, SUITE 405 |
VIENNA, VA 22182 |
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