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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10497635
Issue Dt:
12/03/2019
Application #:
16152182
Filing Dt:
10/04/2018
Publication #:
20190304865
Pub Dt:
10/03/2019
Inventors:
John D. Brazzle, Frederick E. Beville, David R. Ng, Michael J. Anderson, Yucheng Ying
Title:
STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE
Assignment: 1
Reel/Frame:
047073/0275Recorded: 10/04/2018Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BRAZZLE, JOHN D.
Exec Dt:
09/12/2018
BEVILLE, FREDERICK E.
Exec Dt:
08/20/2018
NG, DAVID R.
Exec Dt:
08/16/2018
ANDERSON, MICHAEL J.
Exec Dt:
09/19/2018
YING, YUCHENG
Exec Dt:
08/21/2018
Assignee:
LINEAR TECHNOLOGY HOLDING LLC
ONE TECHNOLOGY WAY
NORWOOD, MASSACHUSETTS 02062
Correspondent:
PATENT LAW GROUP LLP
PO BOX 61839
SUNNYVALE, CA 94088
Assignment: 2
Reel/Frame:
053620/0438Recorded: 08/27/2020Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
LINEAR TECHNOLOGY HOLDING LLC
Exec Dt:
11/05/2018
Assignee:
ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
BAY F1 RAHEEN INDUSTRIAL ESTATE
LIMERICK, IRELAND
Correspondent:
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET
14TH FLOOR
IRVINE, CA 92614

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