Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16309348
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Filing Dt:
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12/12/2018
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Publication #:
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Pub Dt:
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10/10/2019
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Inventors:
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Noriyoshi Uchida, Duck-soo Jang, Ju-Heung Kim, Ho-won Seok
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Title:
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Solder Composition
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 32-1, SENJU ASAHI-CHO |
| ADACHI-KU, TOKYO, JAPAN 1200026 |
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| KILYK & BOWERSOX, P.L.L.C. |
| 3925 CHAIN BRIDGE ROAD, SUITE D-401 |
| FAIRFAX, VA 22030 |
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