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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16169214
Filing Dt:
10/24/2018
Publication #:
Pub Dt:
10/10/2019
Inventors:
Hyung Jun KIM, Seung Tae LEE
Title:
SEMICONDUCTOR DEVICE AND WAFER-LEVEL PACKAGE EACH HAVING REDISTRIBUTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
047307/0017Recorded: 10/25/2018Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/22/2018
Exec Dt:
10/22/2018
Assignee:
77 YEONAMYULGEUM-RO, EUMBONG-MYEON, ASAN-SI
CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31413
Correspondent:
NORTON ROSE FULBRIGHT LLP
98 SAN JACINTO BLVD.
SUITE 1100
AUSTIN, TX 78701
Assignment: 2
Reel/Frame:
055150/0342Recorded: 02/04/2021Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/06/2021
Assignee:
LINE 4, 77, YEONAMYULGEUM-RO, EUMBONG-MYEON, ASAN-SI
CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31413
Correspondent:
NORTON ROSE FULBRIGHT US LLP
98 SAN JACINTO BLVD
SUITE 1100
AUSTIN, TX 78701

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