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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/01/2021
Application #:
16468735
Filing Dt:
06/12/2019
Publication #:
Pub Dt:
10/17/2019
Inventors:
Miki MIYANAGA, Kenichi WATATANI, Hideaki AWATA
Title:
Semiconductor Device and Method for Manufacturing the Same
Assignment: 1
Reel/Frame:
049442/0028Recorded: 06/12/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Exec Dt:
04/10/2019
Assignee:
5-33, KITAHAMA 4-CHOME, CHUO-KU
OSAKA-SHI, JAPAN 541-0041
Correspondent:
BAKER BOTTS LLP C/O INTELLECTUAL PROPERT
THE WARNER
1299 PENNSYLVANIA AVE, NW
WASHINGTON, DC 20004-2400
Assignment: 2
Reel/Frame:
062105/0079Recorded: 12/09/2022Pages: 4
Conveyance:
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/05/2022
Assignee:
1-11-1 OSAKI, SHINAGAWA-KU
TOKYO, JAPAN 1418584
Correspondent:
CPA GLOBAL
CASTLE STREET , LIBERATION HOUSE
ST HELIER, JERSEY, JE1 1BL JERSEY

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