Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/14/2020
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Application #:
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16464704
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Filing Dt:
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05/29/2019
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Publication #:
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Pub Dt:
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10/24/2019
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Inventor:
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Wakahiro KAWAI
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Title:
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Resin-Molded Electronic Device with Disconnect Prevention
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 600-8530 |
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| METROLEXIS LAW GROUP, PLLC |
| 900 17TH STREET, NW. |
| SUITE 320 |
| WASHINGTON, DC 20006 |
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