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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
15960937
Filing Dt:
04/24/2018
Publication #:
Pub Dt:
10/24/2019
Inventors:
Rahul Agarwal, Milind S. Bhagavat, Lei Fu
Title:
HIGH DENSITY FAN-OUT PACKAGING
Assignment: 1
Reel/Frame:
045621/0842Recorded: 04/24/2018Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/23/2018
Exec Dt:
04/23/2018
Assignee:
2485 AUGUSTINE DRIVE
ATTN: LEGAL DEPARTMENT
SANTA CLARA, CALIFORNIA 95054
Correspondent:
TIMOTHY HONEYCUTT, ATTORNEY AT LAW
37713 PARKWAY OAKS LN.
MAGNOLIA, TX 77355
Assignment: 2
Reel/Frame:
045647/0111Recorded: 04/26/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/26/2018
Assignee:
2485 AUGUSTINE DRIVE
ATTN: LEGAL DEPARTMENT
SANTA CLARA, CALIFORNIA 95054
Correspondent:
TIMOTHY HONEYCUTT, ATTORNEY AT LAW
37713 PARKWAY OAKS LN.
MAGNOLIA, TX 77355

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