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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/13/2020
Application #:
15959609
Filing Dt:
04/23/2018
Publication #:
Pub Dt:
10/24/2019
Inventors:
Mingzhu Wang, Nan Guo, Zhenyu Chen, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Ye Wu
Title:
MANUFACTURE OF SEMICONDUCTOR MODULE WITH DUAL MOLDING
Assignment: 1
Reel/Frame:
045847/0001Recorded: 05/18/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/11/2018
Exec Dt:
04/24/2018
Exec Dt:
04/24/2018
Exec Dt:
05/03/2018
Exec Dt:
05/03/2018
Exec Dt:
04/26/2018
Exec Dt:
04/26/2018
Assignee:
66-68 SHUNYU ROAD
YUYAO CITY, NINGBO, CHINA 31500
Correspondent:
SHEPPARD MULLIN RICHTER & HAMPTON LLP
379 LYTTON AVENUE
ALEX Y. NIE
PALO ALTO, CA 94301

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