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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/24/2020
Application #:
16507308
Filing Dt:
07/10/2019
Publication #:
Pub Dt:
10/31/2019
Inventor:
Noriyuki KIMURA
Title:
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
064021/0575Recorded: 06/08/2023Pages: 22
Conveyance:
CHANGE OF ADDRESS
Assignor:
Exec Dt:
04/24/2023
Assignee:
4106-73 OAZA MIYOTA, MIYOTA-MACHI
KITASAKU-GUN,
NAGANO, JAPAN
Correspondent:
TADASHI HORIE
CROWELL & MORING LLP
PO BOX 10395
CHICAGO, IL 60610

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