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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16401009
Filing Dt:
05/01/2019
Publication #:
Pub Dt:
11/07/2019
Inventors:
Dakota F. Ehlenberg, Xiaodan Gu, Song Zhang
Title:
Methodology and Instrumentation for Thin Film Mechanical Analysis
Assignment: 1
Reel/Frame:
060684/0026Recorded: 08/01/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/11/2022
Exec Dt:
07/19/2022
Exec Dt:
07/19/2022
Assignee:
118 COLLEGE DRIVE #5116
HATTIESBURG, MISSISSIPPI 39046
Correspondent:
BUTLER SNOW LLP
6075 POPLAR AVENUE
SUITE 500
MEMPHIS, TN 38119

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