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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/24/2020
Application #:
16389679
Filing Dt:
04/19/2019
Publication #:
Pub Dt:
11/07/2019
Inventors:
Ke-Ying SU, Jon-Hsu HO, Ke-Wei SU, Liang-Yi CHEN, Wen-Hsing HSIEH, Wen-Koi LAI et al
Title:
INTEGRATED CIRCUIT MODELING METHODS AND SYSTEMS
Assignment: 1
Reel/Frame:
049492/0222Recorded: 06/17/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2019
Exec Dt:
05/02/2019
Exec Dt:
05/09/2019
Exec Dt:
05/02/2019
Exec Dt:
05/02/2019
Exec Dt:
05/21/2019
Exec Dt:
05/02/2019
Exec Dt:
05/02/2019
Exec Dt:
05/02/2019
Exec Dt:
05/02/2019
Assignee:
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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