Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/03/2022
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Application #:
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16345704
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Filing Dt:
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04/27/2019
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Publication #:
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Pub Dt:
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11/14/2019
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Inventors:
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Tomoko KATO, Toyohiko FUJISAWA, Harumi KODAMA, Masayuki ONISHI
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Title:
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THERMALLY CONDUCTIVE SILICONE COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23F OTEMACHI FIRST SQUARE BUILDING |
| OTEMACHI, CHIYODA-KU |
| TOKYO, JAPAN 100-004 |
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| WARNER NORCROSS + JUDD LLP |
| 150 OTTAWA AVE NW |
| SUITE 1500 |
| GRAND RAPIDS, MI 49503-2832 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24, HIGASHISHINAGAWA 2- CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 140-8617 |
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| WARNER NORCROSS & JUDD LLP |
| 900 FIFTH THIRD CENTER |
| 111 LYON STREET, N.W. |
| GRAND RAPIDS, MI 49503-2487 |
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