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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/31/2019
Application #:
16522801
Filing Dt:
07/26/2019
Publication #:
Pub Dt:
11/14/2019
Inventors:
Yi Yang, Dongna Shen, Yu-Jen Wang
Title:
Highly Selective Ion Beam Etch Hard Mask for Sub 60nm MRAM Devices
Assignment: 1
Reel/Frame:
049867/0740Recorded: 07/26/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/27/2018
Exec Dt:
03/27/2018
Exec Dt:
03/27/2018
Assignee:
678 S. HILLVIEW DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:
049867/0810Recorded: 07/26/2019Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/04/2019
Assignee:
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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