Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/08/2021
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Application #:
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16466817
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Filing Dt:
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06/05/2019
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Publication #:
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Pub Dt:
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11/14/2019
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Inventors:
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Kai-Jens MATEJAT, Jan SPERLING, Sven LAMPRECHT, Christian OHDE
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Title:
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METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ERASMUSSTRASSE 20 |
| BERLIN, GERMANY 10553 |
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| RENNER OTTO BOISSELLE & SKLAR, LLP |
| 1621 EUCLID AVENUE |
| NINETEENTH FLOOR |
| CLEVELAND, OH 44115 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 200 WEST STREET |
| NEW YORK, NEW YORK 10282 |
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| MONICA ARNOLD, ESQ. |
| 2029 CENTURY PARK EAST, 33RD FLOOR |
| MILBANK, LLP |
| LOS ANGELES, CA 90067 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| ERASMUSSTRASSE 20 |
| BERLIN, GERMANY 10553 |
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| 1750 OVERVIEW DRIVE |
| ROCK HILL, SOUTH CAROLINA 29730 |
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| JAVIER RAMOS |
| 1850 K ST. NW |
| SUITE 1100 |
| WASHINGTON, DC 20006 |
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