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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/27/2021
Application #:
16525114
Filing Dt:
07/29/2019
Publication #:
Pub Dt:
11/21/2019
Inventors:
Yi Liu, Qiang Liu, Arvind V. Harinath, Changsheng C. Su, Behnam Bahrami, A. Carl McDonald et al
Title:
CLOSE COUPLED SINGLE MODULE AFTERTREATMENT SYSTEM
Assignment: 1
Reel/Frame:
049933/0734Recorded: 08/01/2019Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/25/2016
Exec Dt:
02/04/2016
Exec Dt:
01/19/2016
Exec Dt:
02/04/2016
Exec Dt:
02/04/2016
Exec Dt:
01/11/2016
Exec Dt:
01/11/2016
Assignee:
500 JACKSON STREET
COLUMBUS, INDIANA 47201
Correspondent:
ROBERTO J. FERNANDEZ/FOLEY & LARDNER LLP
321 NORTH CLARK STREET, SUITE 2800
CHICAGO, IL 60654

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