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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/30/2021
Application #:
16413068
Filing Dt:
05/15/2019
Publication #:
Pub Dt:
11/21/2019
Inventors:
Yasuo ASADA, Ayano HAGIWARA, Kenji TANOUCHI, Takehiko ORII, Jun LIN, Shinji IRIE et al
Title:
METHOD OF ETCHING SILICON-CONTAINING FILM, COMPUTER-READABLE STORAGE MEDIUM, AND APPARATUS FOR ETCHING SILICON-CONTAINING FILM
Assignment: 1
Reel/Frame:
049211/0735Recorded: 05/17/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Exec Dt:
04/09/2019
Assignee:
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
NATH, GOLDBERG & MEYER
112 S. WEST ST.
36559U_JLM/ALS
ALEXANDRIA, VA 22314

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