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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/12/2021
Application #:
16407245
Filing Dt:
05/09/2019
Publication #:
Pub Dt:
11/21/2019
Inventors:
Yoshinori Ikeda, Shota Umezaki, Kenji Nishi
Title:
SUBSTRATE PROCESSING APPARATUS HAVING TOP PLATE WITH THROUGH HOLE AND SUBSTRATE PROCESSING METHOD
Assignment: 1
Reel/Frame:
049124/0345Recorded: 05/09/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/18/2019
Exec Dt:
04/18/2019
Exec Dt:
04/18/2019
Assignee:
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO 107-6325, JAPAN
Correspondent:
ABELMAN, FRAYNE & SCHWAB/LEE
666 THIRD AVENUE
10TH FLOOR
NEW YORK, NY 10017-4046

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