Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/04/2020
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Application #:
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16046733
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Filing Dt:
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07/26/2018
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Publication #:
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Pub Dt:
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11/21/2019
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Inventor:
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Shuai Guo
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Title:
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Methods and Systems for Adjusting Wafer Deformation During Wafer Bonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 GAOXIN 4TH ROAD |
| EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA 430074 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| 1100 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20005 |
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