Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16341386
|
Filing Dt:
|
04/11/2019
|
|
Publication #:
|
|
Pub Dt:
|
11/28/2019
| | | | |
|
Inventors:
|
Osamu MUNEKATA, Isamu SATO, Naoto KAMEDA, Kaichi TSURUTA
|
|
Title:
|
SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER, RESIN FLUX CORED SOLDER, AND SOLDER JOINT
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
|
|
|
|
| MITSUHIRO HARAGUCHI, LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 106011523 |
|
|
Search Results as of:
04/30/2024 05:02 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
