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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/07/2020
Application #:
16399937
Filing Dt:
04/30/2019
Publication #:
Pub Dt:
12/05/2019
Inventors:
Tong Chen, Wenrui Cai, Albert P. Heberle, Weiping Li
Title:
WAFER-LEVEL HIGH ASPECT RATIO BEAM SHAPING
Assignment: 1
Reel/Frame:
050138/0925Recorded: 08/22/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/29/2019
Exec Dt:
04/29/2019
Exec Dt:
07/30/2019
Exec Dt:
04/29/2019
Assignee:
ONE APPLE PARK WAY
CUPERTINO, CALIFORNIA 95014
Correspondent:
S. CRAIG HEMENWAY
410 SEVENTEENTH STREET
SUITE 2200
DENVER, CO 80202

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