Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/03/2020
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Application #:
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16149102
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Filing Dt:
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10/01/2018
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Publication #:
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Pub Dt:
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12/05/2019
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Inventors:
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Jin Su KIM, Young Gwan KO, Myung Sam KANG, Yong Jin PARK, Yong Jin SEOL
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Title:
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SEMICONDUCTOR PACKAGE INTEGRATING ACTIVE AND PASSIVE COMPONENTS WITH ELECTROMAGNETIC SHIELDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
THE MCDERMOTT BUILDING |
500 NORTH CAPITOL STREET, N.W. |
WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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MORGAN LEWIS & BOCKIUS LLP |
1111 PENNSYLVANIA AVENUE, NW |
WASHINGTON, DC 20004 |
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