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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/14/2020
Application #:
16515588
Filing Dt:
07/18/2019
Publication #:
Pub Dt:
12/05/2019
Inventor:
Cyprian Emeka UZOH
Title:
DIE PROCESSING
Assignment: 1
Reel/Frame:
051055/0585Recorded: 11/19/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/18/2019
Assignee:
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY
ATTN: PATENT DEPARTMENT
SAN JOSE, CA 95134
Assignment: 2
Reel/Frame:
053468/0001Recorded: 06/01/2020Pages: 502
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Assignee:
101 NORTH TRYON STREET
CHARLOTTE, NORTH CAROLINA 28255
Correspondent:
STEWART WALSH
1025 VERMONT AVE NW, SUITE 1130
COGENCY GLOBAL INC.
WASHINGTON, DC 20005

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