Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/30/2020
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Application #:
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15996870
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Filing Dt:
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06/04/2018
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Publication #:
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Pub Dt:
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12/05/2019
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Inventors:
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Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun et al
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Title:
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MULTI-CHIP PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWEGMAN, LUNDBERG & WOESSNER/INTEL |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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