Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16435818
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Filing Dt:
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06/10/2019
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Publication #:
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Pub Dt:
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12/12/2019
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Inventors:
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Shigeki Kondoh, Masato Tsuchiya, Takahiro Roppongi, Hiroyoshi Kawasaki, Hiroki Sudo et al
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Title:
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Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23, SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
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THE WEBB LAW FIRM, P.C. |
ONE GATEWAY CENTER |
420 FT. DUQUESNE BLVD, SUITE 1200 |
PITTSBURGH, PA 15222 |
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