Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16427118
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Filing Dt:
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05/30/2019
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Publication #:
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Pub Dt:
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12/12/2019
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Inventors:
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Wei-Ping Dow, Liang-Jie Lin, Chia-Hsiang Chen
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Title:
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METHOD FOR MANUFACTURING COPPER FOIL WITH ROUGH SURFACE IN PLATING TANK AND ITS PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 145 XINGDA RD., SOUTH DIST. |
| TAICHUNG CITY, TAIWAN 402 |
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| CHAO-CHANG DAVID PAI |
| 1001 FOURTH AVENUE, SUITE 3200 |
| SEATTLE, WA 98154 |
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