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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16433250
Filing Dt:
06/06/2019
Publication #:
Pub Dt:
12/26/2019
Inventor:
Huan Wang
Title:
METHOD FOR MANUFACTURING CONDUCTIVE PLUG BY FILLING CONTACT HOLES WITH CONDUCTIVE MATERIAL
Assignment: 1
Reel/Frame:
049393/0006Recorded: 06/06/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/03/2019
Assignee:
A1501 TECHNOLOGY MANSION, NO. 90 WENSAN ROAD
HANGZHOU, ZHEJIANG PROVINCE, CHINA 310012
Correspondent:
MICHAEL C. STEPHENS, JR.
22779 MONTROSE COURT
LOS GATOS, CA 95033

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