Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16201916
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Filing Dt:
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11/27/2018
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Publication #:
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Pub Dt:
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12/26/2019
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Inventors:
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CHIA-WEI CHEN, SHIN-WEN CHEN, DING-NAN HUANG
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Title:
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ENCAPSULATION STRUCTURE FOR IMAGE SENSOR CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| B2 BUILDING FOXCONN TECHNOLOGY GROUP,DONGHUAN 2ND ROAD,LONGHUA TOWN |
| SHENZHEN, CHINA |
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| KYOKO C. MAKINO |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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