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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/20/2020
Application #:
16445904
Filing Dt:
06/19/2019
Publication #:
Pub Dt:
12/26/2019
Inventors:
Elaina J. Zito, Lee C. Kresge, Ning-Cheng Lee
Title:
PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS VIA UTILIZATION OF ADHESIVE MATERIAL
Assignment: 1
Reel/Frame:
052601/0034Recorded: 05/07/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/24/2020
Exec Dt:
03/24/2020
Exec Dt:
03/24/2020
Assignee:
111 BUSINESS PARK DRIVE
UTICA, NEW YORK 13502
Correspondent:
SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
650 TOWN CENTER DRIVE
4TH FLOOR
COSTA MESA, CA 92626

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