Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/04/2020
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Application #:
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16023596
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Filing Dt:
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06/29/2018
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Publication #:
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Pub Dt:
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01/02/2020
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Inventors:
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Ashkan Seyedi, Marco Fiorentino, Geza Kurczveil, Raymond G. Beausoleil
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Title:
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LASER ASSEMBLY PACKAGING FOR SILICON PHOTONIC INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11445 COMPAQ CENTER DRIVE WEST |
| HOUSTON, TEXAS 77070 |
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| HEWLETT PACKARD ENTERPRISE |
| 3404 E. HARMONY ROAD MS 79 |
| FORT COLLINS, CO 80528 |
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