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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/21/2020
Application #:
16024670
Filing Dt:
06/29/2018
Publication #:
Pub Dt:
01/02/2020
Inventors:
Hong-Tsz Pan, Nui Chong, Gamal Refai-Ahmed, Jonathan Chang, Henley Liu, Suresh Ramalingam
Title:
INTEGRATED CIRCUIT DIE WITH IN-CHIP HEAT SINK
Assignment: 1
Reel/Frame:
046255/0986Recorded: 07/02/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/29/2018
Exec Dt:
06/15/2018
Exec Dt:
06/12/2018
Exec Dt:
06/19/2018
Exec Dt:
06/13/2018
Exec Dt:
06/15/2018
Assignee:
2100 LOGIC DRIVE
SAN JOSE, CALIFORNIA 95124
Correspondent:
XILINX, INC ATTN: LEGAL DEPARTMENT
2100 LOGIC DR
SAN JOSE, CA 95124

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