Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16578014
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Filing Dt:
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09/20/2019
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Publication #:
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Pub Dt:
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01/09/2020
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Inventors:
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Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhenyu CHEN, Heng JIANG, Nan GUO
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Title:
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SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68 SHUNYU ROAD, YUYAO CITY |
| NINGBO, ZHEJIANG, CHINA 315400 |
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| HARVEST IP LAW LLP |
| 1455 PENNSYLVANIA AVENUE NW, SUITE 400 |
| WASHINGTON, DC 20004 |
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