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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/27/2022
Application #:
16482854
Filing Dt:
08/01/2019
Publication #:
Pub Dt:
01/09/2020
Inventors:
Seung Sik HONG, Motonobu TAKEYA
Title:
LIGHT EMITTING DIODE PACKAGE
Assignment: 1
Reel/Frame:
049932/0374Recorded: 08/01/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/01/2019
Assignee:
97-11, SANDAN-RO 163BEON-GIL
DANWON-GU, GYEONGGI-DO
ANSAN-SI, KOREA, REPUBLIC OF 15429
Correspondent:
H.C. PARK & ASSOCIATES, PLC
1894 PRESTON WHITE DRIVE
RESTON, VA 20191
Assignment: 2
Reel/Frame:
050627/0988Recorded: 10/04/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/04/2019
Assignee:
97-11, SANDAN-RO 163BEON-GIL
DANWON-GU, GYEONGGI-DO
ANSAN-SI, KOREA, REPUBLIC OF 15429
Correspondent:
H.C. PARK & ASSOCIATES, PLC
1894 PRESTON WHITE DRIVE
RESTON, VA 20191

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