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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/19/2022
Application #:
16503773
Filing Dt:
07/05/2019
Publication #:
Pub Dt:
01/30/2020
Inventors:
Po-Hsun HUANG, Po-Han WANG, Ing-Ju LEE, Chao-Lung CHEN, Cheng-Ming WU
Title:
METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-BARRIER FILMS
Assignment: 1
Reel/Frame:
053349/0408Recorded: 07/29/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/20/2019
Exec Dt:
12/10/2019
Exec Dt:
04/24/2020
Exec Dt:
12/12/2019
Exec Dt:
12/11/2019
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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