Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/01/2020
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Application #:
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16047888
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Filing Dt:
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07/27/2018
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Publication #:
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Pub Dt:
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01/30/2020
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Inventors:
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Dibyajat Mishra, Ashok Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar et al
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Title:
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BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD |
| M/S 3999 |
| DALLAS, TEXAS 75243 |
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| DAWN JOS |
| P O BOX 655474 |
| M/S 3999 |
| DALLAS, TX 75265 |
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