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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16341258
Filing Dt:
04/11/2019
Publication #:
Pub Dt:
02/06/2020
Inventors:
Liang CHEN, Ping JIA, Lijuan ZHU, Yujie CHEN
Title:
ALUMINUM ALLOY SEMI-SOLID MOLDING METHOD AND DEVICE
Assignment: 1
Reel/Frame:
048861/0579Recorded: 04/11/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/10/2019
Exec Dt:
04/10/2019
Exec Dt:
04/10/2019
Exec Dt:
04/10/2019
Assignee:
THE ECONOMIC DEVELOPMENT AREA, JIANGLE COUNTY
SANMING CITY, CHINA 353300
Correspondent:
STEVEN M. RABIN
SUITE 500, 1101 14TH STREET, N.W.
WASHINGTON DC, 20005 UNITED STATES

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