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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15576892
Filing Dt:
11/27/2017
Publication #:
Pub Dt:
02/06/2020
Inventors:
Hidemi NAWAFUNE, Hiroshi NISHIWAKI, Toshikazu MURATA, Hidehiro YOSHIOKA et al
Title:
PLATING SOLUTION AND METHOD FOR PRODUCING PLATED PRODUCT
Assignment: 1
Reel/Frame:
044794/0657Recorded: 02/01/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/28/2017
Exec Dt:
12/28/2017
Exec Dt:
12/28/2017
Exec Dt:
12/28/2017
Exec Dt:
12/28/2017
Assignees:
3-4-5, TECHNO-STAGE, IZUMI-CITY,
OSAKA, JAPAN 594-1144
3-16-20, TSUGIYA, AMAGASAKI-CITY,
HYOGO, JAPAN 661-0965
Correspondent:
CLARK & BRODY
1700 DIAGONAL ROAD, SUITE 510
ALEXANDRIA, VA 22314

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