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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/15/2021
Application #:
16658355
Filing Dt:
10/21/2019
Publication #:
Pub Dt:
02/13/2020
Inventors:
Ping-Yin Liu, Chia-Shiung Tsai, Pin-Nan Tseng, Yeur-Luen Tu, Xiaomeng Chen
Title:
Dual Facing BSI Image Sensors with Wafer Level Stacking
Assignment: 1
Reel/Frame:
050774/0722Recorded: 10/21/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/09/2013
Exec Dt:
09/09/2013
Exec Dt:
09/09/2013
Exec Dt:
09/09/2013
Exec Dt:
09/08/2013
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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