Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2021
|
Application #:
|
16373900
|
Filing Dt:
|
04/03/2019
|
|
Publication #:
|
|
Pub Dt:
|
02/20/2020
| | | | |
|
Inventors:
|
Chih-Hang TUNG, Tung-Liang SHAO, Su-Chun YANG, Geng-Ming CHANG, Chen-Hua YU
|
|
Title:
|
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
|
|
Search Results as of:
05/29/2024 04:32 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
