Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16673201
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Filing Dt:
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11/04/2019
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Publication #:
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Pub Dt:
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02/27/2020
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Inventor:
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Fabian Mohn
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Title:
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RESIN ENCAPSULATED POWER SEMICONDUCTOR MODULE WITH EXPOSED TERMINAL AREAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BRUGGERSTRASSE 66 |
| BADEN, SWITZERLAND 5400 |
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| JOHN H. ALLIE |
| TAFT STETTINIUS & HOLLISTER LLP |
| ONE INDIANA SQUARE, SUITE 3500 |
| INDIANAPOLIS, IN 46204-2023 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND ASSIGNEE PREVIOUSLY RECORDED AT REEL: 052298 FRAME: 0048. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| BRUGGERSTRASSE 66 |
| BADEN, SWITZERLAND 5400 |
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| POSTFACH 10 04 57 |
| INGOLSTADT, GERMANY 85045 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BRUGGERSTRASSE 72 |
| BADEN, SWITZERLAND 5400 |
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| SAGE PATENT GROUP |
| PO BOX 30789 |
| RALEIGH, NC 27622-0789 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| BRUGGERSTRASSE 72 |
| BADEN, SWITZERLAND 5400 |
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| SAGE PATENT GROUP |
| PO BOX 30789 |
| RALEIGH, NC 27622-0789 |
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05/21/2024 05:37 AM
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