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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/18/2022
Application #:
16674216
Filing Dt:
11/05/2019
Publication #:
Pub Dt:
02/27/2020
Inventors:
Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze et al
Title:
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
Assignment: 1
Reel/Frame:
050916/0771Recorded: 11/05/2019Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/30/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/30/2015
Assignee:
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
ESCHWEILER & POTASHNIK, LLC
ROSETTA CENTER
629 EUCLID AVE., SUITE 1000
CLEVELAND, OH 44114

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