Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16607542
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Filing Dt:
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10/23/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Takahiro Matsui, Yutaka Ochi, Hitoshi Nakamura, Yukihiro Matsumoto
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Title:
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BOND CONSTRUCTION AND BONDING METHOD OF FRP MATERIAL TO STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1 NIHONBASHI-MUROMACHI 2-CHOME |
CHUO-KU |
TOKYO, JAPAN 1038666 |
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3-1, NISHISHINJUKU 2-CHOME |
SHINJUKU-KU |
TOKYO, JAPAN 163-0926 |
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1-1, HIBARIGAOKA, TEMPAKU-CHO |
TOYOHASHI-SHI |
AICHI, JAPAN 441-8580 |
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JAYA SHARMA |
RATNERPRESTIA |
2200 RENAISSANCE BLVD., SUITE 350 |
KING OF PRUSSIA, PA 19406 |
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03/29/2024 09:21 AM
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