Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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16422071
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Filing Dt:
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05/24/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Jr-Sheng CHEN, An-Chi Li, Shih-Che Huang, Chih-Hsien Hsu, Zhi-Hao Huang, Alex Wang et al
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Title:
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BAFFLE PLATE FOR CONTROLLING WAFER UNIFORMITY AND METHODS FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| DUANE MORRIS LLP (TSMC) IP DEPARTMENT |
| 750 B STREET, SUITE 2900 |
| SAN DIEGO, 92101-4681 UNITED STATES |
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