Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16401558
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Filing Dt:
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05/02/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Hee Ju SEO, Sung Bok HONG, Jae Won CHOI, Young Jin HWANG
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Title:
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SEMICONDUCTOR PACKAGE MOLDING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MUIR PATENT LAW, PLLC |
| P.O. BOX 1213 |
| GREAT FALLS, VA 22066 |
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