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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/18/2020
Application #:
16120922
Filing Dt:
09/04/2018
Publication #:
Pub Dt:
03/05/2020
Inventors:
Woochan Kim, Anindya Poddar, Vivek Arora
Title:
PACKAGED SEMICONDUCTOR DEVICES FOR HIGH VOLTAGE WITH DIE EDGE PROTECTION
Assignment: 1
Reel/Frame:
046779/0627Recorded: 09/04/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2018
Exec Dt:
08/24/2018
Exec Dt:
08/24/2018
Assignee:
12500 TI BLVD
M/S 3999
DALLAS, TEXAS 75243
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, M/S 3999
DALLAS, TX 75265
Assignment: 2
Reel/Frame:
049360/0972Recorded: 06/04/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/04/2018
Exec Dt:
10/05/2018
Exec Dt:
10/04/2018
Assignee:
12500 TI BLVD.
DALLAS, TEXAS 75243
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, M/S 3999
DALLAS, TX 75265

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