Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16218769
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Filing Dt:
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12/13/2018
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Guilian GAO, Gaius Gillman FOUNTAIN JR., Laura Wills MIRKARIMI, Rajesh KATKAR et al
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Title:
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LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMPERATURES IN MICROELECTRONICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3025 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA 95134 |
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CHRISTOPHER W. LATTIN |
3025 ORCHARD PARKWAY |
C/O: INVENSAS BONDING TECHNOLOGIES, INC. |
SAN JOSE, CA 95134 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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101 NORTH TRYON STREET |
CHARLOTTE, NORTH CAROLINA 28255 |
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STEWART WALSH |
1025 VERMONT AVE NW, SUITE 1130 |
COGENCY GLOBAL INC. |
WASHINGTON, DC 20005 |
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05/09/2024 08:02 AM
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