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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/18/2021
Application #:
16218769
Filing Dt:
12/13/2018
Publication #:
Pub Dt:
03/05/2020
Inventors:
Guilian GAO, Gaius Gillman FOUNTAIN JR., Laura Wills MIRKARIMI, Rajesh KATKAR et al
Title:
LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMPERATURES IN MICROELECTRONICS
Assignment: 1
Reel/Frame:
047769/0913Recorded: 12/13/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/05/2018
Exec Dt:
11/05/2018
Exec Dt:
12/12/2018
Exec Dt:
11/05/2018
Exec Dt:
11/09/2018
Exec Dt:
11/06/2018
Assignee:
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
CHRISTOPHER W. LATTIN
3025 ORCHARD PARKWAY
C/O: INVENSAS BONDING TECHNOLOGIES, INC.
SAN JOSE, CA 95134
Assignment: 2
Reel/Frame:
053468/0001Recorded: 06/01/2020Pages: 502
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Exec Dt:
06/01/2020
Assignee:
101 NORTH TRYON STREET
CHARLOTTE, NORTH CAROLINA 28255
Correspondent:
STEWART WALSH
1025 VERMONT AVE NW, SUITE 1130
COGENCY GLOBAL INC.
WASHINGTON, DC 20005

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