Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/20/2021
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Application #:
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16569601
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Filing Dt:
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09/12/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Mingzhu WANG, Zhenyu CHEN, Nan GUO, Takehiko Tanaka, Bojie ZHAO, Zilong DENG
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Title:
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Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68 SHUNYU ROAD, |
| YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400 |
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| RAYMOND Y CHAN |
| 108 N. YNEZ AVE., SUITE 128 |
| MONTEREY PARK, CA 91754 |
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